 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Surface Mount PTC FSMD1206 Series Lead Free Component Application: All high-density boards Product Features: Small surface mount, Solid state Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 50mA~1.5A Maximum Voltage: 6V~60V Temperature Range: -40 to 85 Agency Recognition: Pending Electrical Characteristics(23) Part Number FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 FSMD050-1206 FSMD075-1206 FSMD100-1206 FSMD150-1206 Hold Trip Current Current IH,A 0.05 0.10 0.20 0.35 0.50 0.75 1.00 1.50 Rated Voltage VMAX,Vdc 60 60 30 16 8 6 6 6 Max Typical Max Time to Trip Current Power Current Time IMAX, A 10 10 10 40 40 40 40 40 Resistance Tolerance R MIN R1 MAX 3.60 1.60 0.60 0.30 0.15 0.10 0.055 0.040 IT,A 0.15 0.25 0.40 0.75 1.00 1.50 1.80 3.00 Pd, W 0.4 0.4 0.4 0.4 0.4 0.6 0.6 0.8 A 0.25 0.50 8.00 8.00 8.00 8.00 8.00 8.00 Sec 1.50 1.00 0.05 0.10 0.10 0.20 0.30 1.00 50.00 15.00 2.50 1.20 0.70 0.29 0.210 0.120 IH=Hold current-maximum current at which the device will not trip at 23still air. IT=Trip current-minimum current at which the device will always trip at 23 still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I max) I MAX= Maximum fault current device can withstand without damage at rat ed voltage (V max). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 still air environment. RMIN=Minimum device resistance at 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour post trip. Termination pad characteristics Termination pad materials : solder-plated copper NOTE : All Specification subject to change without notice . 49 PDF created with FinePrint pdfFactory trial version http://www.pdffactory.com Surface Mount PTC FSMD1206 Series FSMD Product Dimensions (Millimeters) Part Number FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 FSMD050-1206 FSMD075-1206 FSMD100-1206 FSMD150-1206 A Min 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 Max 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 Min 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 B Max 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 Min 0.45 0.45 0.45 0.45 0.25 0.45 0.75 0.80 C Max 0.75 0.75 0.75 0.75 0.55 1.25 1.25 1.80 D Min 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Thermal Derating Curve Thermal Derating Curve, FSMD1206 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (C) NOTE : All Specification subject to change without notice . 50 PDF created with FinePrint pdfFactory trial version http://www.pdffactory.com Surface Mount PTC FSMD1206 Series Typical Time-To-Trip at 23 Z =FSMD005-1206 A =FSMD010-1206 B =FSMD020-1206 C =FSMD035-1206 D =FSMD050-1206 E =FSMD075-1206 F =FSMD100-1206 G =FSMD150-1206 A 100 10 Time-to-trip (S) 1 0.1 B C D EF G Z 0.01 0.001 0.1 1 Fault current (A) 10 100 Part Numbering System FSMD Part Marking System F Current rating Part Identification Fuzetec Logo FA Example FZ =FSMD005-1206 FA =FSMD010-1206 FB =FSMD020-1206 FC =FSMD035-1206 FD =FSMD050-1206 FE =FSMD075-1206 FF =FSMD100-1206 FG=FSMD150-1206 Standard Package P/N FSMD005-1206 FSMD010-1206 FSMD020-1206 FSMD035-1206 Pcs /Bag ----------------------------- Reel/Tape 4K 4K 4K 4K P/N FSMD050-1206 FSMD075-1206 FSMD100-1206 FSMD150-1206 Pcs /Bag ----------------------------- Reel/Tape 4K 4K 4K 4K Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame. -PPTC device are intended for occasional o vercurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. NOTE : All Specification subject to change without notice . 51 PDF created with FinePrint pdfFactory trial version http://www.pdffactory.com Surface Mount PTC FSMD1206 Series Pad LayoutsSolder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1206 device Pad dimensions(millimeters) A B Device Nominal Nominal FSMD005-1206 2.00 1.00 FSMD010-1206 2.00 1.00 FSMD020-1206 2.00 1.00 FSMD035-1206 2.00 1.00 FSMD050-1206 2.00 1.00 FSMD075-1206 2.00 1.00 FSMD100-1206 2.00 1.00 FSMD150-1206 2.00 1.00 Solder reflow C Nominal 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 Due to "Lead Free" nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 1. Recommended reflow methods; IR , vapor phase oven, hot air oven. 2. The FSMD1206 Series are suitable for use with wave-solder application methods. 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned using standard industry methods and solvents. CAUTION: If reflow temperatures exceed the recommended Profile, devices may not meet the performance requirements. Rework: Use standard industry practices. NOTE : All Specification subject to change without notice . 52 PDF created with FinePrint pdfFactory trial version http://www.pdffactory.com |
Price & Availability of FSMD005-1206
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |